Electronic device having wireless power transmitting/receiving conductive pattern

ABSTRACT

Various embodiments of the present disclosure may provide an electronic device that includes: a first plate directed in a first direction, a second plate directed in a second direction opposite to the first direction, and a side member configured to surround at least a part of the space between the first and second plates; a first printed circuit board (PCB) that is disposed between the first and second plates and includes at least one processor; a second printed circuit board (PCB) that is disposed between the first printed circuit board and the second plate and includes at least one antenna pattern; and a temperature sensor disposed to measure the temperature of at least a part of the second printed circuit board. Other various embodiments are possible.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a continuation of application Ser. No. 15/236,374,filed Aug. 12, 2016, which priority to Korean Application Serial No.10-2015-0114199, filed Aug. 12, 2015, the disclosures of which arehereby incorporated by reference.

BACKGROUND 1. Field

Various embodiments of the present disclosure relate to a temperaturesensor mounting structure for detecting the temperature of a wirelesscharging coil.

2. Description of Related Art

Wireless charging devices (e.g., systems) may convert electrical energyinto an electromagnetic wave form of energy to wirelessly transfer theenergy as a load without a transmission line.

Wireless charging may be mainly classified into a charging type usingelectromagnetic induction and a charging type using magnetic resonance.The electromagnetic induction type charging technique is a method ofcharging a battery while a charging pad and two coils of an electronicdevice generate an induced current, and the magnetic resonance typecharging technique is a method of performing charging by transmittingpower to a transmitting/receiving end, which is 1 to 2 meter (m) away,at the same frequency.

The magnetic induction type charging technique, which is one of thewireless charging techniques, is a method of transferring power using amagnetic field induced in a coil, and may supply energy as a load bymaking an induced current flow in a receiving coil using a magneticfield generated by a current that flows in a transmission coil. Thereare standards of the magnetic induction type including wireless powerconsortium (WPC) and power matters alliance (PMA), etc. The WPC may usea power transmission frequency of 110 to 205 kilohertz (kHz), and thePMA may use a power transmission frequency of 227 to 357 kHz or 118 to153 kHz.

SUMMARY

When an electronic device that supports wireless powertransmission/reception transmits and receives power in a wirelessmanner, the surface temperature of the electronic device may increase,which causes a limitation of usability.

For example, when misalignment occurs between a wireless powertransmitting electronic device and a wireless power receiving electronicdevice, heat energy may be generated due to degradation in powertransmission efficiency, which causes an increase in the surfacetemperature of the wireless power transmitting electronic device orwireless power receiving electronic device.

Although the wireless power transmitting/receiving electronic deviceshave temperature sensors (thermistors) in order to measure the internaltemperature thereof, the temperature sensors may fail to accuratelymeasure the surface temperature of the electronic devices that isgenerated during wireless power transmission/reception because thetemperature sensors are not located close to conductive patterns for thewireless power transmission/reception.

Various embodiments of the present disclosure may provide an electronicdevice in which a temperature sensor can be mounted without an increasein the thickness of the electronic device.

Further, various embodiments of the present disclosure may provide amethod and device that can accurately measure temperature in order toeffectively control the heat dissipation of an electronic device duringwireless power transmission/reception, thereby effectively controllingthe heat dissipation based on the accurate temperature.

Various embodiments of the present disclosure provide an electronicdevice that includes: a first plate directed in a first direction, asecond plate directed in a second direction opposite to the firstdirection, and a side member configured to surround at least a part ofthe space between the first and second plates; a first printed circuitboard (PCB) that is disposed between the first and second plates andincludes at least one processor; a second printed circuit board (PCB)that is disposed between the first printed circuit board and the secondplate and includes at least one antenna pattern; and a temperaturesensor disposed to measure the temperature of at least a part of thesecond printed circuit board.

Various embodiments of the present disclosure provide an electronicdevice that includes: a printed circuit board (PCB); at least onewireless power supply coil mounted on the PCB; at least one temperaturesensor disposed around the coil on the PCB; a battery pack disposed toface the coil; and a rear case in which the battery pack isaccommodated, and the temperature sensor may be disposed around thecoil.

Various embodiments of the present disclosure provide an electronicdevice that includes: a support structure; a display disposed on a firstsurface of the support structure; a first PCB disposed on a secondsurface opposite to the first surface of the support structure; a rearcase coupled to the support structure; a battery pack accommodated inthe rear case; a front cover disposed on the front of the display; arear cover disposed on the back of the rear case; a second PCB mountedon the rear cover; a wireless charging antenna provided on the secondPCB; and at least one temperature sensor disposed around the antenna ofthe second PCB.

According to the various embodiments of the present disclosure, atemperature sensor can be mounted in an electronic device without anincrease in the thickness of the electronic device.

In addition, the various embodiments of the present disclosure mayprovide a method capable of accurately measuring the temperature of awireless power transmitting/receiving conductive pattern using atemperature sensor mounted in an electronic device.

Before undertaking the DETAILED DESCRIPTION below, it may beadvantageous to set forth definitions of certain words and phrases usedthroughout this patent document: the terms “include” and “comprise,” aswell as derivatives thereof, mean inclusion without limitation; the term“or,” is inclusive, meaning and/or; the phrases “associated with” and“associated therewith,” as well as derivatives thereof, may mean toinclude, be included within, interconnect with, contain, be containedwithin, connect to or with, couple to or with, be communicable with,cooperate with, interleave, juxtapose, be proximate to, be bound to orwith, have, have a property of, or the like; and the term “controller”means any device, system or part thereof that controls at least oneoperation, such a device may be implemented in hardware, firmware orsoftware, or some combination of at least two of the same. It should benoted that the functionality associated with any particular controllermay be centralized or distributed, whether locally or remotely.Definitions for certain words and phrases are provided throughout thispatent document, those of ordinary skill in the art should understandthat in many, if not most instances, such definitions apply to prior, aswell as future uses of such defined words and phrases.

BRIEF DESCRIPTION OF THE DRAWINGS

For a more complete understanding of the present disclosure and itsadvantages, reference is now made to the following description taken inconjunction with the accompanying drawings, in which like referencenumerals represent like parts:

FIG. 1A illustrates a front perspective view of an electronic deviceaccording to various embodiments of the present disclosure;

FIG. 1B illustrates a rear perspective view of the electronic deviceaccording to the various embodiments of the present disclosure;

FIG. 1C illustrates views of the electronic device when viewed from thefront, top, bottom, left, and right according to the various embodimentsof the present disclosure;

FIG. 2 illustrates an exploded perspective view of a configuration of anelectronic device according to various embodiments of the presentdisclosure;

FIG. 3A illustrates an exploded perspective view of a state in which awireless power transmitting/receiving member is applied to an electronicdevice according to various embodiments of the present disclosure;

FIG. 3B illustrates a configuration of a housing to which the wirelesspower transmitting/receiving member is applied according to variousembodiments of the present disclosure;

FIG. 3C illustrates a sectional view of major parts of a state in whichthe wireless power transmitting/receiving member is electricallyconnected to a printed circuit board (PCB) according to variousembodiments of the present disclosure;

FIG. 4 illustrates a view of a state in which coils and temperaturesensors of an antenna are arranged according to various embodiments ofthe present disclosure;

FIG. 5 illustrates a view of a rear case according to variousembodiments of the present disclosure;

FIG. 6A illustrates a sectional view of a state in which a coil and atemperature sensor of an antenna and a battery pack are arrangedaccording to various embodiments of the present disclosure;

FIG. 6B illustrates a section view taken along line A-A according tovarious embodiments of the present disclosure;

FIG. 7 illustrates a view of a state in which coils and temperaturesensors of an antenna are arranged according to various embodiments ofthe present disclosure;

FIGS. 8A to 8D illustrate a view of various patterns of temperaturesensors according to various embodiments of the present disclosure;

FIG. 9 illustrates a view of a state in which coils and temperaturesensors of an antenna are arranged according to various embodiments ofthe present disclosure;

FIGS. 10 to 12 illustrate views of thermal spreading sheets that areattached to coils and a temperature sensor of an antenna according tovarious embodiments of the present disclosure;

FIG. 13A illustrates a method for manufacturing a temperature sensor inwhich wires and coils are formed in different layers according tovarious embodiments of the present disclosure;

FIG. 13B illustrates a flowchart of a manufacturing method according tovarious embodiments of the present disclosure;

FIG. 14A illustrates a method for manufacturing a temperature sensor inwhich wires and coils are formed in the same layer according to variousembodiments of the present disclosure;

FIG. 14B illustrates a flowchart of a manufacturing method according tovarious embodiments of the present disclosure; and

FIG. 15 illustrates a block diagram of an electronic device according tovarious embodiments of the present disclosure.

DETAILED DESCRIPTION

FIGS. 1A through 15, discussed below, and the various embodiments usedto describe the principles of the present disclosure in this patentdocument are by way of illustration only and should not be construed inany way to limit the scope of the disclosure. Those skilled in the artwill understand that the principles of the present disclosure may beimplemented in any suitably arranged electronic devices. The disclosureis described with reference to the accompanying drawings. The disclosuremay be changed and may include various examples, and specific examplesare exemplarily described and related detailed descriptions are made inthe specification. However, it should be understood that the variousexamples of the disclosure are not limited to a specific embodied formand include all modifications and/or equivalents or substitutions thatfall within the spirit and technical scope of the disclosure. In thedrawing, like reference numerals are used for like elements.

Expressions such as “include” or “may include”, etc. that may be used inthe disclosure indicate existence of a disclosed relevant function,operation, or element, etc., and do not limit additional one or morefunctions, operations, or elements, etc. Also, it should be understoodthat terminologies such as “include” or “have”, etc. in the disclosureare intended for designating existence of a characteristic, a number, astep, an operation, an element, a part, or a combination of thesedescribed on the specification and do not exclude in advance existenceor addition possibility of one or more other characteristics, numbers,steps, operations, elements, parts, or a combination of these.

Expression such as “or”, etc. in the disclosure includes a certain andall combinations of words listed together. For example, “A or B” mayinclude A and may include B, or include both A and B. In the disclosure,expressions such as “1st”, “2nd”, “first” or “second”, etc. may modifyvarious elements of the disclosure but do not limit relevant elements.For example, the expressions do not limit sequence and/or importance,etc. of relevant elements. The expressions may be used fordiscriminating one element from another element. For example, both afirst user apparatus and a second user apparatus are all userapparatuses, and represent different user apparatuses. For example, afirst element may be named as a second element without departing fromthe scope of the disclosure, and similarly, the second element may benamed as the first element. When it is mentioned that a certain elementis “connected to” or “accesses” another element, it should be understoodthat the element may be directly connected to another element or maydirectly access another element, but still another element may exist inthe middle. In contrast, when it is mentioned that a certain element is“directly connected to” or “directly accesses” another element, itshould be understood that still another element does not exist in themiddle. Terminology used in the disclosure is used for explaining only aspecific example and is not intended to limit the disclosure. Unlessclearly expressed otherwise, expression of the singular includesexpression of the plural. Unless defined differently, all terminologiesused herein including technological or scientific terminologies have thesame meaning as that generally understood by a person of ordinary skillin the art to which the disclosure belongs. It should be understood thatgenerally used terminologies defined by a dictionary have meaningcoinciding with meaning on context of a related technology, and unlessclearly defined in the disclosure, they are not understood as an idealor excessively formal meaning.

An electronic device of disclosure may be a device including acommunication function. For example, an electronic device may include atleast one of a smartphone, a tablet personal computer (PC), a mobilephone, a video phone, an e-book reader, a desktop PC, a laptop PC, anetbook computer, a Personal Digital Assistant (PDA), a PortableMultimedia Player (PMP), an MP3 player, a mobile medical device, acamera, or a wearable device (e.g., a head-mounted-device (HMD) such aselectronic glasses, an electronic clothing, an electronic bracelet, anelectronic necklace, an electronic appcessory, an electronic tattoo, ora smartwatch).

According to certain examples, an electronic device may be a smart homeappliance having a communication function. A smart home appliance mayinclude, for example, at least one of a television, a Digital Video Disk(DVD) player, an audio, a refrigerator, an air conditioner, a cleaner,an oven, an electronic range, a washing machine, an air purifier, aset-top box, a TV box (e.g., Samsung HomeSync™, Apple TV™, or GoogleTV™), game consoles, an electronic dictionary, an electronic key, acamcorder, or an electronic frame.

According to certain examples, an electronic device may include at leastone of various medical devices (e.g., Magnetic Resonance Angiography(MRA), Magnetic Resonance Imaging (MRI), Computed Tomography (CT), ashooting device, an ultrasonic device, etc.), a navigation device, aGlobal Positioning System (GPS) receiver, an event data recorder (EDR),a flight data recorder (FDR), an automobile infotainment device,electronic equipment for a ship (e.g., a navigation device for a ship, agyro compass, etc.), an avionics, a security device, or a robot for anindustrial use or a home use.

According to certain examples, an electronic device may include at leastone of furniture or a portion of a building/structure including acommunication function, an electronic board, an electronic signaturereceiving device, a projector, or various measurement devices (e.g.,waterworks, electricity, gas, or radio wave measuring device, etc.). Anelectronic device according to the disclosure may be a combination ofone or more of the above-described devices. Also, it will be apparent toone skilled in the art that the electronic device examples of thedisclosure are not limited to the above-described devices.

An electronic device according to various examples of the disclosure isdescribed with reference to the accompanying drawings. A terminology ofa user used in various examples may indicate a person who uses anelectronic device or a device (e.g., an artificial intelligenceelectronic device) that uses the electronic device. FIG. 1A illustratesa front perspective view of an electronic device according to variousembodiments. FIG. 1B illustrates a rear perspective view of theelectronic device according to the various embodiments. FIG. 1Cillustrates views of the electronic device, according to the variousembodiments, when viewed from the front, top, bottom, left, and right.

Referring to FIGS. 1A to 1C, the electronic device 100, according to thevarious embodiments, may have a display 101 (or referred to as the touchscreen) mounted on the front thereof. A receiver 102 may be disposed onthe upper side of the display 101 to receive a counterpart's speech. Amicrophone 103 may be disposed on the lower side of the display 101 totransmit, to the counterpart, a speech of a user that uses theelectronic device.

Components for performing various functions of the electronic device 101may be disposed around the receiver 102. The components may include atleast one sensor 104. The sensor 104 may include, for example, at leastone of an illuminance sensor (e.g., an optical sensor), a proximitysensor (e.g., an optical sensor), an infrared sensor, and an ultrasonicsensor. According to an embodiment, the components may include a frontcamera 105. According to an embodiment, the components may also includean indicator 106 for informing the user of state information of theelectronic device 100.

The display 101 may be formed to be large in size in order to coveralmost the entire front of the electronic device 100. The main homescreen is the first screen that is displayed on the display 101 when theelectronic device 100 is turned on. Further, when the electronic device100 has multiple pages of different home screens, the main home screenmay be the first home screen of the multiple pages of home screens.Short-cut icons for executing frequently used applications, a main menuswitch key, time, weather, and the like may be displayed on the homescreen. The main menu switch key is used to display a menu screen on thedisplay 101. Further, a status bar that indicates the state of theelectronic device 100 (such as a battery charging state, the strength ofa received signal, and the current time) may be formed on the upper endof the display 101. A home key 110 a, a menu key 110 b, and a back key110 c may be formed on the lower side of the display 101.

The home key 110 a is used to display the main home screen on thedisplay 101. For example, the home screen may be mainly displayed on thedisplay 101 when the home key 110 a is touched while a home screen thatis different from the main home screen, or the menu screen, is displayedon the display 101. Further, when the home key 110 a is touched whileapplications are being executed on the display 101, the main home screenmay be displayed on the display 101. In addition, the home key 110 a mayalso be used to display recently used applications or a task manager onthe display 101.

The menu key 110 b provides a connectivity menu that may be used on thedisplay 101. The connectivity menu may include a widget addition menu, abackground screen switch menu, a search menu, an editing menu, anenvironment configuration menu, etc. The back key 110 c may be used todisplay the screen that was executed just before the currently executedscreen, or to end the most recently used application.

The electronic device 100, according to the various embodiments, mayinclude a metal frame 120 as a metal housing. The metal frame 120 may bedisposed along the outer periphery of the electronic device 100, and mayextend to at least one area of the back of the electronic device 100,which is connected to the outer periphery of the electronic device. Themetal frame 120 may define at least a part of the thickness of theelectronic device 100 along the outer periphery of the electronic device100, and may be formed in a closed loop shape. Without being limitedthereto, however, the metal frame 120 may be formed such that itcontributes to at least a part of the thickness of the electronic device100.

The metal frame 120 may also be disposed only in at least one area ofthe outer periphery of the electronic device 100. In a case where themetal frame 120 serves as a part of the housing of the electronic device100, the rest of the housing may be replaced with a non-metal member. Inthis case, the housing may be formed in such a manner that the non-metalmember is insert-molded into the metal frame 120. The metal frame 120may include one or more cut-off portions 125 and 126, and unit metalframes separated by the cut-off portions 125 and 126 may be used asantenna coils. An upper frame 123 may serve as a unit frame by a pair ofcut-off portions 125 that are formed with a predetermined intervaltherebetween. A lower frame 124 may serve as a unit frame by a pair ofcut-off portions 126 that are formed with a predetermined intervaltherebetween. The cut-off portions 125 and 126 may be formed togetherwhen the non-metal member is insert-molded into the metal member.

The metal frame 120 may have a closed loop shape along the outerperiphery of the electronic device, and may be disposed in such a mannerthat the metal frame 120 contributes to the whole thickness of theelectronic device 100. When the electronic device 100 is viewed from thefront, the metal frame 120 may include a left frame 121, a right frame122, the upper frame 123, and the lower frame 124.

Various electronic components may be disposed in the lower frame 124 ofthe electronic device. A speaker 108 may be disposed on one side of themicrophone 103. An interface connector 107 may be disposed on theopposite side of the microphone 103 to perform datatransmission/reception with an external device and to receive externalpower in order to charge the electronic device 100. An ear-jack hole 109may be disposed on one side of the interface connector 107. Themicrophone 103, the speaker 108, the interface connector 107, and theear-jack hole 109 may all be disposed within the area of the unit framethat is formed by the pair of cut-off portions 126 disposed in the lowerframe 124. Without being limited thereto, however, at least one of theaforementioned electronic components may be disposed in the area thatincludes the cut-off portion 126, or may be disposed outside the unitframe.

Various electronic components may also be disposed on the upper frame123 of the electronic device 100. A socket device 116, into which acard-type external device is inserted, may be disposed in the upperframe 123. The socket device 116 may receive at least one of a unique IDcard (e.g., a SIM card, a UIM card, etc.) for the electronic device 100and a memory card for increasing a storage space. An infrared sensor 118may be disposed on a side of the socket device 116, and an auxiliarymicrophone device 117 may be disposed on a side of the infrared sensor118. The socket device 116, the infrared sensor 118, and the auxiliarymicrophone device 117 may all be disposed within the area of the unitframe that is formed by the pair of cut-off portions 125 disposed in theupper frame 123. Without being limited thereto, however, at least one ofthe aforementioned electronic components may be disposed within the areathat includes the cut-off portion 125, or may be disposed outside thecut-off portions.

At least one first side key button 111 may be disposed in the left frame121 of the metal frame 120. A pair of first side key buttons 111 mayprotrude from the left frame 121 and may serve to perform a volumeup/down function, a scroll function, etc. At least one second side keybutton 112 may be disposed in the right frame 122 of the metal frame120. The second side key button 112 may serve to perform a power on/offfunction, a wake-up/sleep function of the electronic device, etc. Atleast one key button 110 may be disposed in at least one area on thelower side of the display 101 on the front 1001 of the electronic device100. The key button 110 may perform a home key button function. A fingerscan sensor device may be disposed on the top of the home key button.The home key button may serve to perform a first function (a home screenreturn function, a wake-up/sleep function, etc.) by an operation ofphysically pressing the home key button and to perform a second function(e.g., a finger scan function) by an operation of swiping the top of thehome key button. Although not illustrated, touch pads may be disposed onthe left and right sides of the key button 110 to perform a touchfunction.

A rear camera 113 may be disposed on the back 1002 of the electronicdevice 100, and at least one electronic component 114 may be disposed ona side of the rear camera 113. The electronic component 114 may includeat least one of an illuminance sensor (e.g., an optical sensor), aproximity sensor (e.g., an optical sensor), an infrared sensor, anultrasonic sensor, a heart-rate sensor, and a flash device.

The front 1001 of the electronic device 100, on which the display 101 ismounted, may include a flat surface portion 1011 and left and rightcurved surface portions 1012 and 1013 that are formed on the left andright sides of the flat surface portion 1011. The front 1001 of theelectronic device 100 may include both the display area 101 and theremaining area (e.g., BM area) using a single window. The left and rightcurved surface portions 1012 and 1013 may extend from the flat surfaceportion 1011 in the X-axis direction of the electronic device 100. Theleft and right curved surface portions 1012 and 1013 may serve as a partof the lateral side of the electronic device 100. In this case, the leftand right curved surface portions 1012 and 1013 and the left and rightframes 121 and 122 of the metal frame 120 may serve as the lateral sideof the electronic device 100 together. Without being limited thereto,however, the front 1001 of the electronic device 100, on which thedisplay 101 is mounted, may include only at least one of the left andright curved surface portions 1012 and 1013. The front 1001 of theelectronic device 100 may also be configured to include only the leftcurved surface portion 1012 along the flat surface portion 1011, or toinclude only the right curved surface portion 1013 along the flatsurface portion 1011.

The front 1001 of the electronic device 100 may include: a window (130,illustrated in FIG. 3) that includes the curved surface portions 1012and 1013 on the left and right sides thereof; and a flexible displaythat is applied to at least one area on the lower side of the window.The area that includes the flexible display may serve as the display101. According to an embodiment, the window (130, illustrated in FIG. 3)may be formed in such a manner (hereinafter, referred to as the ‘3Dtype’) that the top and bottom thereof are simultaneously bent. Withoutbeing limited thereto, however, the window (130, illustrated in FIG. 3)may also be formed in such a manner (hereinafter, referred to as the‘2.5D type’) that the left and right portions of the top thereof areformed in a curved shape and the back thereof is formed in a flat shape.The window may be formed of a transparent glass (e.g., sapphire glass)or a transparent synthetic resin.

The electronic device 100 may control the display to selectively displayinformation. The electronic device 100 may control the display toconfigure a screen only on the flat surface portion 1011. The electronicdevice 100 may control the display to configure a screen on the flatsurface portion 1011 and one of the left and right curved surfaceportions 1012 and 1013. The electronic device 100 may control thedisplay to configure a screen only on at least one of the left and rightcurved surface portions 1012 and 1013, except the flat surface portion1011.

The back 1002 of the electronic device 100 may also be formed by asingle rear external surface mounting member 115 on the whole. The back1002 of the electronic device 100 may include a flat surface portion1151 that is formed around the center thereof on the whole and left andright curved surface portions 1152 and 1153 that are formed on the leftand right sides of the flat surface portion 1151, respectively. Thewindow 115 may be configured in a 2.5D type such that the left and rightcurved surface portions 1152 and 1153 of the outer surface are formed ina curved shape and the back thereof is formed in a flat shape. Withoutbeing limited thereto, however, the window 115 may also be formed in the3D type similar to the window disposed on the front 1001 of theelectronic device 100. The left and right curved surface portions 1152and 1153 may serve as a part of the lateral side of the electronicdevice 100. In this case, the left and right curved surface portions1152 and 1153 and the left and right frames 121 and 122 of the metalframe 120 may serve as the lateral side of the electronic device 100together. Without being limited thereto, however, the back 1002 of theelectronic device 100 may include only at least one of the left andright curved surface portions 1152 and 1153. The back 1002 of theelectronic device 100 may also be configured to include only the leftcurved surface portion 1152 along the flat surface portion 1151, or toinclude only the right curved surface portion 1153 along the flatsurface portion 1151.

The upper left and right corner portions and the lower left and rightcorner portions of the front 1001 of the electronic device 100 may beformed such that the upper left and right corner portions and the lowerleft and right corner portions are simultaneously inclined in theX-axis, Y-axis, and Z-axis directions while the window is being bent. Byvirtue of this shape, the upper left and right corner portions and thelower left and right corner portions of the metal frame 120 may beformed such that the heights thereof gradually decrease.

FIG. 2 illustrates an exploded perspective view of an electronic deviceaccording to various embodiments of the present disclosure. Hereinafter,the electronic device 200 in the drawing may be the same electronicdevice as the above-described electronic device 100.

Referring to FIG. 2, the electronic device 200 may be configured suchthat a PCB 260, a bracket 220, a display 230, and a front window 240(referred to as the first plate that is approximately directed in afirst direction) are sequentially stacked above the housing 210.According to an embodiment, a wireless power transmitting/receivingmember 280 (may include a flexible printed circuit board having anantenna pattern provided thereon) and a rear window 250 (referred to asthe second plate that is approximately directed in a second directionopposite to the first direction) are sequentially stacked below thehousing 210. According to an embodiment, a battery pack 270 may beaccommodated in a battery pack receiving space 211 formed in the housing210 and may be disposed so as to not overlap the PCB 260. According toan embodiment, the battery pack 270 and the PCB 260 may be disposed inparallel so as to not overlap each other. According to an embodiment,the display 230 may be secured to the bracket 220, and the front window240 may be secured in such a manner that the front window 240 isattached to the bracket 220 by a first adhesive member 291. According toan embodiment, the rear window 250 may be secured in such a manner thatthe rear window 250 is attached to the housing 210 by a second adhesivemember 292. The electronic device, according to the various embodiments,may include a side member that surrounds at least a part of the spacebetween the first plate and the second plate.

According to various embodiments, the front window 240 may include aflat surface portion 240 a and left and right bent portions 240 b and240 c that are bent from the flat surface portion 240 a in oppositedirections. According to an embodiment, the front window 240 ispositioned on the top of the electronic device 200 to form the front ofthe electronic device 200, and is formed of a transparent material todisplay a screen presented by the display 230 and to provide aninput/output window for various sensors. According to an embodiment,while a shape in which the left and right bent portions 240 b and 240 care formed in a 3D type is illustrated, a shape may be applied in whichthe upper and lower portions, as well as the left and right portions,are single-bent, or a shape in which the upper, lower, left, and rightportions are dual-bent. According to an embodiment, a touch panel may befurther disposed on the back of the front window 240 and may receive atouch input signal from the outside.

According to various embodiments, the display 230 may also be formed ina shape corresponding to that of the front window 240 (a shape having acurvature corresponding to that of the front window 240). According toan embodiment, the display 230 may include the left and right bentportions 230 b and 230 c on the left and right sides of the flat surfaceportion 230 a. According to an embodiment, a flexible display may beused as the display 230. According to an embodiment, in a case where thefront window 240 has the back in the shape of a window of a planar type(hereinafter, 2D type or 2.5D type), a general Liquid crystal display(LCD) or an on-cell tsp AMOLED (OCTA) may be applied since the back ofthe front window 240 is planar.

According to various embodiments, the first adhesive member 291 is acomponent for securing the front window 240 to the bracket 220 that isdisposed within the electronic device, and may be a kind of tape, suchas a double-sided tape, or a liquid adhesive layer, such as a bond.According to an embodiment, in a case where a double-sided tape isapplied as the first adhesive member 291, a general poly ethyleneterephthalate (PET) or a functional base may be applied as the internalbase of the first adhesive member 291. For example, by using a baseformed of a foam tape or shock-resistive fabric material so as toreinforce the shock resistance, it is possible to prevent the frontwindow from being damaged by external impact.

According to various embodiments, the bracket 220 may be disposed withinthe electronic device 200 so as to be used as a component for increasingthe rigidity of the whole electronic device. According to an embodiment,the bracket 220 may be formed of at least one metal selected fromaluminum (Al), magnesium (Mg), and stainless steel (STS). According toan embodiment, the bracket 220 may be formed of a highly rigid plastic,in which glass fibers are contained, or may be formed of a combinationof a metal and a plastic. According to an embodiment, in a case where ametal member and a non-metal member are used together, the bracket 220may be formed by insert-molding the non-metal member into the metalmember. According to an embodiment, the bracket 220 is placed on theback of the display 230. The bracket 220 may have a shape (curvature)that is similar to the shape of the back of the display 230 and maysupport the display 230. According to an embodiment, an elastic member(such as a sponge or a rubber), an adhesive layer (such as adouble-sided tape), or a kind of sheet (such as a single-sided tape) maybe additionally disposed between the bracket 220 and the display 230 soas to protect the display 230. According to an embodiment, a section ofthe bracket 220 may further include a spot-facing or hole area 221 forensuring a component mounting space or a marginal space in considerationof a change of a component during use, such as the swelling of thebattery pack 270. According to an embodiment, as needed, a sheet-typemetal or composite material may be added to the corresponding hole area221 so as to reinforce the internal rigidity, or an auxiliary device forimproving a thermal characteristic, an antenna characteristic, or thelike may be further provided in the hole area 221. According to anembodiment, the bracket 220 may be fastened to the housing (e.g., therear case) 210 so as to form a space therein, and at least oneelectronic component may be disposed in the space. The electroniccomponent may include a Printed Circuit Board (PCB) 260. Without beinglimited thereto, however, the electronic component may include anantenna device, a sound device, a power supply device, a sensor device,or the like in addition to the PCB 260.

According to various embodiments, the battery pack 270 may supply powerto the electronic device 200. According to an embodiment, one surface ofthe battery pack 270 may be adjacent to the display 230, and theopposite surface thereof may be adjacent to the rear window 250, whichmay cause the deformation and damage of the counterpart objects when thebattery pack 270 expands while being recharged. In order to preventthis, a space (swelling gap) may be provided between the battery pack270 and the counterpart objects (e.g., the display 230 and the rearwindow 250) so as to protect the counterpart objects. According to anembodiment, the battery pack 270 may be disposed in a form of beingintegrated with the electronic device 200. Without being limitedthereto, however, the battery pack 270 may be implemented to bedetachable when the rear window 250 is implemented to be detachable inthe electronic device 200.

According to various embodiments, the housing 210 may form the exterior(e.g., the lateral side that includes a metal bezel) of the electronicdevice 200 and may be coupled with the bracket 220 to form an internalspace. According to an embodiment, the front window 240 may be disposedon the front of the housing 210, and the rear window 250 may be disposedon the back of the housing 210. Without being limited thereto, however,the back of the housing 210 may be implemented with various materials,such as a synthetic resin, a metal, a composite material of a metal anda synthetic resin, etc. According to an embodiment, the gap between theinternal structures, which is formed by the housing 210 and the rearwindow 250, may prevent the rear window 250 from being damaged by asecondary hit of the internal structures when an external shock (such asa fall of the electronic device) occurs.

According to various embodiments, the wireless powertransmitting/receiving member 280 may be disposed on the back of thehousing 210. According to an embodiment, the wireless powertransmitting/receiving member 280 mainly has a thin film shape and isattached to one surface of an internally mounted component or one areaof the inner surface of the housing 210; in particular, to an area thatis adjacent to the rear window 250. The wireless powertransmitting/receiving member 280 includes a structure that forms acontact point with the PCB 260 within the housing 210. According to anembodiment, the wireless power transmitting/receiving member 280 may beembedded or attached as a component of the battery pack 270 or the like,or a part of the housing 210, and may be provided in the form of beingattached to both of the component and the housing 210.

According to various embodiments, the second adhesive member 292 is acomponent for securing the rear window 250 to the housing 210, and maybe applied in a shape similar to that of the above-described firstadhesive member 291.

According to various embodiments, the rear window 250 may be applied ina shape similar to that of the above-described front window 240.According to an embodiment, the front (the side exposed to the outside)of the rear window 250 may be formed to have a gradually increasingcurvature toward the opposite left and right ends thereof. According toan embodiment, the back of the rear window 250 may be formed in a flatsurface so as to be attached to the housing 210 by the second adhesivemember 292.

FIG. 3A illustrates an exploded perspective view of a state in which anantenna is applied to an electronic device according to variousembodiments of the present disclosure. FIG. 3B illustrates a view of aconfiguration of a housing 300 (used interchangeably with a rear case)to which the antenna is applied, according to various embodiments of thepresent disclosure. FIG. 3C illustrates a sectional view of major partsof a state in which the antenna is electrically connected to a PCBaccording to various embodiments of the present disclosure.

Referring to FIGS. 3A to 3C, a wireless power transmitting/receivingmember 310 may be disposed to face a rear window over a partial area ofthe housing 300 and a battery pack 330 (corresponding to 270 of FIG. 2).According to an embodiment, the wireless power transmitting/receivingmember 310 may be a communication interface, such as a wireless charginginterface, a near field communication (NFC) or magnetic secure transfer(MST) antenna, etc.

According to various embodiments, the housing 300 may have an opening301 in which the battery pack 330 is accommodated, and one or moreflanges 3011 and 3012 may protrude along the outer periphery of theopening 301 in the direction of the opening 301. According to anembodiment, the wireless power transmitting/receiving member 310 may beattached to the flanges 3011 and 3012 and one surface of the batterypack 330.

According to various embodiments, the wireless powertransmitting/receiving member 310 may be formed in the shape of a thinfilm, and may include a plurality of antenna coils. According to anembodiment, the plurality of antenna coils may be wound on the film invarious ways (e.g., a spiral type) according to the characteristic ofthe corresponding communication interface. According to an embodiment,the plurality of antenna coils may be disposed parallel to each other onthe same plane of a single film.

According to various embodiments, the wireless powertransmitting/receiving member 310 may include a body portion 311 that isdisposed on the flanges 3011 and 3012 of the opening 301 and one surfaceof the battery pack 330, a tail portion 312 withdrawn from the bodyportion 311, and a contact portion 313 withdrawn from the body portion311. According to an embodiment, the contact portion 313 may be disposedto correspond to a plurality of contact terminals 321 mounted on a PCB320. According to an embodiment, when the body portion 311 correspondsto the front of the housing 300, or is disposed on the front of thehousing 300, the contact portion 313 may be disposed on the back of thehousing 300 so as to be brought into physical or electrical contact withthe contact terminals 321 of the PCB 320 below the housing 300.

According to various embodiments, a plurality of electronic components302 and 303 may be mounted on the housing 300, and the tail portion 312may be disposed to receive the electronic components 302 and 303.According to an embodiment, the tail portion 312 may include an internalspace, and the wireless power transmitting/receiving member 311 may bedisposed in such a manner that the electronic components 302 and 303 aredisposed in the internal space. According to an embodiment, theelectronic components may include the above-described rear camera 302,various types of sensors, and a flash device 303.

FIG. 4 illustrates a view of a configuration of an antenna of anelectronic device according to various embodiments of the presentdisclosure.

Referring to FIG. 4, a wireless power transmitting/receiving member 440(hereinafter, referred to as the antenna) may include a body portion 441that is applied to an opening of a housing (rear case), a tail portion442 that is withdrawn from the body portion 441 to have a predeterminedinternal space, and a contact portion 443 that is withdrawn from thebody portion 441 to electrically and physically, or electrically,contact a contact terminal of a PCB.

According to various embodiments, the antenna 440 may be formed in afilm type and may have a plurality of antenna coils that are disposed onthe same plane so as to be spaced apart from each other and areconnected to the contact portion 443. According to an embodiment, awireless charging antenna coil (circuit) 445 for wireless charging (WPC)(hereinafter, referred to as the first coil) may be spirally disposedaround the center of the body portion 441. According to an embodiment,an antenna coil (circuit) 446 for Magnetic Secure Transfer (MST)(hereinafter, referred to as the second coil) may be spirally disposedon the body portion 441 to surround the first coil 445. According to anembodiment, an antenna coil (circuit) 447 for Near Field Communication(NFC) (hereinafter, referred to as the third coil) may be spirallydisposed along the tail portion 442. According to an embodiment, thefirst to third coils 445, 446, and 447 may be disposed on the same planeof the film so as to be spaced apart from each other.

In the arrangement of the first to third coils 445, 446, and 447, thefirst coil 445 may be disposed in the substantially central area, thesecond coil 446 may be disposed to surround the first coil 445, and thethird coil 447 may be disposed beside the first and second coils 445 and446.

The antenna 440, according to the various embodiments, may have one ormore temperature sensors 451 and 452 disposed thereon for identifying adegree to which heat is generated therefrom. Although it is desirable tomeasure the temperatures of all the first to third coils 445, 446, and447, the second and third coils 446 and 447 are not heated at allbecause the operating time thereof is very short. However, since thefirst coil 445 is frequently over-heated due to a long charging time, itis necessary to accurately measure the temperature of the heated firstcoil 445.

One or more temperature sensors 451 and 452, according to the variousembodiments, may be disposed on the antenna 440 so as to not causeserious damage to the RF performance of the first to third coils 445,446, and 447.

In FIG. 4, the temperature sensors, according to the variousembodiments, are illustrated as being disposed in the first and secondpositions 401 and 402. The temperature sensors may be disposed in thefirst and second positions 401 and 402. The temperature sensor 451 maybe disposed in the first position 401, namely, around the first coil 445or around the second coil 446. Further, the temperature sensor 451 maybe disposed on the PCB in the empty space inside the third coil 447. Thetemperature sensor 451 may be preferably disposed in the first position401 in consideration of the mounting space of the temperature sensor451.

FIG. 5 illustrates a view of a rear case according to variousembodiments of the present disclosure.

Referring to FIG. 5, the rear case 500, according to the variousembodiments, may have a first opening 510 in which a battery pack 520 isaccommodated parallel thereto without overlap. The first opening 510 mayhave an area sufficient to accommodate the battery pack 520 parallelthereto. The rear case 500, according to the various embodiments, mayhave a second opening 512 for accommodating a chip-type(protrusion-type) temperature sensor mounted on a PCB. The secondopening 512 may be formed in a shape sufficient to accommodate thetemperature sensor, which may be, for example, in a semi-cylindricalshape or a semi-cylindrical recess shape.

The second opening 512 may be disposed in a portion of the area aroundthe first opening 510. In other words, the second opening 512 may bedisposed in a portion of the area around the battery pack 520 mounted inthe first opening 510. When the battery pack 520 is mounted in the firstopening 510, the side of the mounted battery pack 520 may face thesecond opening 512.

FIG. 6A illustrates a sectional view of a state in which a coil and atemperature sensor of an antenna and a battery pack are arrangedaccording to various embodiments of the present disclosure. FIG. 6Billustrates a section view taken along line A-A According to variousembodiments of the present disclosure.

Referring to FIGS. 6A and 6B, when an electronic device, according tovarious embodiments, is assembled, the battery pack 620 may be placed ina first opening 610 formed in a rear case 600, the antenna 630 may bedisposed above the battery pack 620 to face the same, and a rear cover640 on which the antenna 630 is mounted may be disposed on the outermostside of the rear case 600.

One of the lateral sides of the battery pack 620 may face a secondopening 612 and may be adjacent thereto. The well-know battery pack 620may include a plurality of battery cells (not illustrated) and aprotection circuit module (PCM) 621. The PCM 621, which is a supporterthat is formed of a synthetic resin and has a battery protection circuit(not illustrated) and a plurality of charging terminals (notillustrated) therein, may be provided on a side of the battery pack 620.When the battery pack 620 is accommodated in the first opening 610, thePCM (supporter) 621 for the battery pack may be most adjacent to thesecond opening 612 and may face the same. According to an embodiment, atemperature sensor 631 may be accommodated in the second opening 612. Ina case where the temperature sensor 631 is mounted in a chip type on aPCB, a space for accommodating the temperature sensor 631 is requiredbecause the temperature sensor 631 has a slightly protruding shape, andthe temperature sensor 631 may be accommodated in the second opening612. If the second opening 612 does not exist, the temperature sensor631 is disposed to overlap the rear case 600 so that the temperaturesensor may be pressed or damaged and may thus be likely to malfunction.According to various embodiments, the temperature sensor 631 may beconfigured to be mounted on the PCM 621. If there is no interferencewith the temperature sensor 631 since the first opening 610 of the rearcase 600 is sufficiently large, the temperature sensor 631 may belocated on the surface corresponding to the circuit of the battery PCM621 without the second opening 612. Reference numeral 630 a indicates ashield material for shielding heat transfer.

FIG. 7 illustrates a view of a configuration of an antenna according tovarious embodiments of the present disclosure.

Referring to FIG. 7, the antenna 740, according to the variousembodiments, may include a body portion 741 that is applied to anopening of a rear case, a tail portion 742 that is withdrawn from thebody portion 741 to have a predetermined internal space, and a contactportion 743 that is withdrawn from the body portion 741 to makeelectrical or physical contact with a contact terminal of a PCB 760.

In FIG. 7, temperature sensors, according to various embodiments, areillustrated as being disposed in first to third positions 701 to 703.The temperature sensors may be selectively disposed in the first tothird positions 701 to 703. The temperature sensor 751 may be disposedin the first position 701 (i.e., in the central area inside a firstcoil), or the temperature sensor 753 may be disposed in the secondposition 702 (i.e., may be disposed to overlap the first coil 745(formed on the PCB)). Further, the temperature sensor 755 may bedisposed in the third position 703 (i.e., in an area between the firstand second coils 745 and 746). In consideration of the mounting space ofthe temperature sensors, pattern-type temperature sensors, rather thanchip-type temperature sensors, may be formed in the first to thirdpositions.

The temperature sensors may be disposed to at least partially overlapthe first coil that has the highest heating value, or may be disposedaround the first coil. Since the first coil releases the greatest amountof heat in the antenna, the temperature sensors may be preferablydisposed adjacent to the first coil. The temperature sensors disposed inthe first to third positions, respectively, may be connected to thecontact portion 743 by wire lines.

FIG. 8 illustrates a view of various patterns of temperature sensorsaccording to various embodiments of the present disclosure.

Referring to FIG. 8, the temperature sensors, according to the variousembodiments, may be formed in a pattern type on PCBs. The temperaturesensors formed on the PCBs may be manufactured in various patterns. FIG.8(a) illustrates a temperature sensor having a linear pattern. FIG. 8(b)illustrates a temperature sensor having a zigzag pattern. FIG. 8(c)illustrates a temperature sensor having a right-angled spiral pattern.FIG. 8(d) illustrates a temperature sensor having a loop pattern. Thetemperature sensors, according to an embodiment, may have various shapesaccording to the mounting positions thereof. In a case where a pluralityof temperature sensors is mounted in an electronic device, differenttypes of patterns may be mounted.

FIG. 9 illustrates a view of a state in which coils and temperaturesensors of an antenna are arranged according to various embodiments ofthe present disclosure.

Referring to FIG. 9, in the arrangement of first to third coils 945,946, and 947, the first coil 945 may be disposed in the substantiallycentral area, the second coil 946 may be disposed to surround the firstcoil 945, and the third coil 947 may be disposed beside the first andsecond coils 945 and 946.

The antenna 940, according to the various embodiments, may havetemperature sensors disposed thereon for identifying a heating value.The temperature sensors, according to various embodiments, may bedisposed so as to not affect the RF performance of the first to thirdcoils 945, 946, and 947. The sensors 951 and 953 illustrated in FIG. 9may be chip-type temperature sensors. The temperature sensors 951 and953 may be mounted on a PCB 941.

The temperature sensors, according to the various embodiments, may bedisposed in first and second positions 901 and 902, respectively. Thetemperature sensor 951 disposed in the first location 901 or thetemperature sensor 953 disposed in the second position 902 may beselectively disposed. Each of the temperature sensors may be disposed inthe first position 901 (i.e., in the central area inside the first coil945), or may be disposed in the second position 902 (i.e., may be formedto overlap the first coil 945 (formed on the PCB)). Without beinglimited thereto, however, the temperature sensors may be mounted invarious positions so as to not degrade the RF performance of the firstto third coils 945, 946, and 947.

The temperature sensors may be disposed to overlap the first coil thathas the highest heating value, or may be disposed around the first coil.The temperature sensors 951 and 953 disposed in the first and secondpositions, respectively, may be connected to the contact portion by wirelines.

FIGS. 10 to 12 illustrate views of thermal spreading sheets that areattached to coils and a temperature sensor of an antenna according tovarious embodiments of the present disclosure.

Referring to FIG. 10, a thermal spreading sheet 1060 may be attached toan antenna 1040 according to various embodiments. The antenna 1040 mayhave first to third coils 1045, 1046, and 1047 disposed thereon. Thethermal spreading sheet 1060 may be attached for surface heatdissipation of the first coil 1045 since the first coil 1045 has thehighest heating value. In particular, the thermal spreading sheet 1060spreads the heat released from the first coil 1045 to a temperaturesensor 1051 so that the temperature sensor may accurately measure thetemperature of the first coil. To this end, the thermal spreading sheet1060 may be configured to cover the PCB 1041 on which the first andsecond coils 1045 and 1046 are mounted. The thermal spreading sheet 1060may be formed of a metal sheet (such as a copper sheet, an aluminumsheet, etc.), a graphite sheet, etc. According to an embodiment, thetemperature sensor 1051 may be disposed in a first position around thefirst and second coils 1045 and 1046, and the thermal spreading sheet1060 may be attached to an area that includes the surrounding area ofthe first and second coils 1045 and 1046. The thermal spreading sheet1060, according to the various embodiments, may be disposed to at leastpartially contact the printed circuit board.

Referring to FIG. 11, a thermal spreading sheet 1160 may be attached toan antenna 1140 according to various embodiments. The antenna 1140 mayhave first to third coils 1145, 1145, and 1047 disposed thereon. Thethermal spreading sheet 1160 may be attached in order to reduce thesurface heat dissipation of the first coil 1145 since the first coil1145 has the highest heating value. In particular, the thermal spreadingsheet 1160 spreads the heat released from the first coil 1145 to atemperature sensor 1151 so that the temperature sensor may accuratelymeasure the temperature of the first coil. In a case where thetemperature sensor 1151 is a chip-type temperature sensor, the thermalspreading sheet 1160 may be attached to the remaining area other thanthe temperature sensor 1151.

To this end, the thermal spreading sheet 1160 may be configured to coverthe PCB 1141 on which the first and second coils 1145 and 1146 aremounted. The thermal spreading sheet 1160 may be formed of a metal sheet(such as a copper sheet, an aluminum sheet, etc.), a graphite sheet,etc. According to an embodiment, the temperature sensor 1151 may bedisposed in a first position around the first and second coils 1145 and1146, and the thermal spreading sheet 1160 may be attached to an areathat includes the surrounding area of the first and second coils 1145and 1146.

Referring to FIG. 12, a thermal spreading sheet 1260 may be attached toan antenna 1240 according to various embodiments. The antenna 1240 mayhave first to third coils 1245, 1246, and 1247 disposed thereon. Thethermal spreading sheet 1260 may be attached for surface heatdissipation of the first coil 1245 since the first coil 1045 has thehighest heating value. In particular, the thermal spreading sheet 1260spreads the heat released from the first coil 1245 to a temperaturesensor 1251 so that the temperature sensor may accurately measure thetemperature of the first coil. To this end, the thermal spreading sheet1260 may be configured to cover the PCB 1241 on which the first andsecond coils 1245 and 1246 are mounted. The temperature sensor 1251 maybe disposed between the first and second coils 1245 and 1246, and thethermal spreading sheet 1260 may be attached to an area that includesthe surrounding area of the first and second coils 1245 and 1246. Inthis case, if the temperature sensor 1251 is mounted in a chip type onthe PCB 1241, the thermal spreading sheet 1260 may be attached to theremaining area other than the surrounding area of the temperature sensor1251.

An electronic device, according to various embodiments of the presentdisclosure, may include: a printed circuit board (PCB); at least onewireless power supply coil mounted on the PCB; at least one temperaturesensor disposed around the coil on the PCB; a battery pack disposed toface the coil; and a rear case in which the battery pack isaccommodated, and the temperature sensor may be disposed around thecoil.

According to various embodiments of the present disclosure, the rearcase may have a rear cover coupled thereto, and the PCB on which thecoil is mounted may be mounted on the inside of the rear cover.

According to various embodiments of the present disclosure, the rearcase may have a first opening in which the battery pack is accommodated,and the temperature sensor may be disposed around the first opening.

According to various embodiments of the present disclosure, a firstposition may be an area around the coil and may be situated around thebattery pack.

According to various embodiments of the present disclosure, theelectronic device may further include a second opening in which thetemperature sensor is accommodated and that is formed around the firstopening.

According to various embodiments of the present disclosure, thetemperature sensor may be accommodated in the second opening and may bedisposed adjacent to a PCM of the battery pack to face the same.

According to various embodiments of the present disclosure, the secondopening may be formed in a recess shape that is sufficient toaccommodate the temperature sensor.

According to various embodiments of the present disclosure, thetemperature sensor may be mounted in a chip type on the PCB, or may beformed in a pattern type.

According to various embodiments of the present disclosure, thetemperature sensor may be formed in one pattern shape of a linear shape,a zigzag shape, a spiral shape, and a loop shape.

According to various embodiments of the present disclosure, a thermalspreading sheet and a heat shielding material may be attached to thetemperature sensor.

According to various embodiments of the present disclosure, a thermalspreading sheet may be additionally attached to the remaining coilmounting area other than the temperature sensor when the temperaturesensor is mounted in a chip type in a first position.

According to various embodiments of the present disclosure, a thermalspreading sheet may be additionally attached to the coil mounting areathat contains the temperature sensor when the temperature sensor ismounted in a pattern type in a first position.

According to various embodiments of the present disclosure, the coil mayinclude a wireless charging coil antenna, a wireless short-rangecommunication coil antenna, and a secure transfer coil antenna, and thetemperature sensor may be disposed around the wireless charging coilantenna.

An electronic device, according to various embodiments of the presentdisclosure, may include: a support structure; a display disposed on afirst surface of the support structure; a first PCB disposed on a secondsurface opposite to the first surface of the support structure; a rearcase coupled to the support structure; a battery pack accommodated inthe rear case; a front cover disposed on the front of the display; arear cover disposed on the back of the rear case; a second PCB mountedon the rear cover; a wireless charging antenna provided on the secondPCB; and at least one temperature sensor disposed around the antenna ofthe second PCB.

According to various embodiments of the present disclosure, the frontcover or the rear cover may be formed of a synthetic resin material, ametal material, a glass material, or a combination thereof, and may beflat or may have a curved edge.

According to various embodiments of the present disclosure, thetemperature sensor may be accommodated in a first opening of the rearcase so as to be adjacent to the battery pack accommodated therein.

According to various embodiments of the present disclosure, thetemperature sensor may be formed around the first opening and may beaccommodated in a second opening adjacent to the battery pack.

According to various embodiments of the present disclosure, the batterypack may be disposed parallel to the rear case without overlapping thesame.

According to various embodiments of the present disclosure, the antennamay be disposed to overlap the battery pack while facing the same.

According to various embodiments of the present disclosure, thetemperature sensor may be accommodated in a second opening to face a PCMof the battery pack.

An electronic device, according to various embodiments of the presentdisclosure, may include: a first plate directed in a first direction, asecond plate directed in a second direction opposite to the firstdirection, and a side member configured to surround at least a part ofthe space between the first and second plates; a first printed circuitboard (PCB) that is disposed between the first and second plates andincludes at least one processor; a second printed circuit board (PCB)that is disposed between the first printed circuit board and the secondplate and includes at least one antenna pattern; and a temperaturesensor disposed to measure the temperature of at least a part of thesecond printed circuit board.

According to various embodiments of the present disclosure, at least apart of the temperature sensor may be disposed on the second printedcircuit board or in the interior thereof.

According to various embodiments of the present disclosure, the secondprinted circuit board may include a flexible printed circuit board; theantenna pattern may include a first coil-type antenna pattern and asecond coil-type antenna pattern configured to surround the firstantenna pattern when viewed from above the second plate; and thetemperature sensor may be disposed outside the second antenna patternwhen viewed from above the second plate.

According to various embodiments of the present disclosure, the secondprinted circuit board may include a flexible printed circuit board; theantenna pattern may include a first coil-type antenna pattern and asecond coil-type antenna pattern configured to surround the firstantenna pattern when viewed from above the second plate; and thetemperature sensor may be disposed within the area surrounded by thefirst antenna pattern when viewed from above the second plate.

According to various embodiments of the present disclosure, the secondprinted circuit board may include a flexible printed circuit board; theantenna pattern may include a first coil-type antenna pattern and asecond coil-type antenna pattern configured to surround the firstantenna pattern when viewed from above the second plate; and thetemperature sensor may be disposed to at least partially overlap thefirst antenna pattern when viewed from above the second plate.

According to various embodiments of the present disclosure, the secondprinted circuit board may include a flexible printed circuit board; theantenna pattern may include at least one coil-type antenna pattern; andthe temperature sensor may be disposed outside the antenna pattern whenviewed from above the second plate.

According to various embodiments of the present disclosure, theelectronic device may further include at least one of a wirelesscharging circuit, an NFC circuit, and a magnetic secure transfercircuit, and the at least one antenna pattern may be electricallyconnected to the at least one circuit.

According to various embodiments of the present disclosure, theelectronic device may further include a thermal spreading sheet disposedbetween the first and second printed circuit boards, and the temperaturesensor may be disposed to make contact with, or adjacent to, a part ofthe thermal spreading sheet.

According to various embodiments of the present disclosure, the thermalspreading sheet may be disposed to at least partially contact the secondprinted circuit board.

Hereinafter, a method for manufacturing a pattern-type temperaturesensor on a substrate will be described with reference to theaccompanying drawings. The temperature sensor on the substrate may beconfigured such that wires and coils are formed in different layers orin the same layer.

FIG. 13A illustrates a method for manufacturing a temperature sensor inwhich wires and coils are formed in different layers according tovarious embodiments of the present disclosure

FIG. 13B illustrates a flowchart of a manufacturing method according tovarious embodiments of the present disclosure.

The method for manufacturing a temperature sensor in which wires andcoils are formed in different layers, according to the variousembodiments of the present disclosure, will be described with referenceto FIGS. 13A and 13B.

Upper and lower copper layers 1301 may be formed on the top and bottomof a prepared substrate 1300 (operation 1320; copper clad laminate(CCL)).

Upper and lower coil patterns 1301 a that constitute coils to bedescribed below may be formed on the upper and lower copper layers 1301using dry films 1032 (Operation 1321). The upper and lower coil patterns(FIG. 13(c)) may be formed by attaching the dry films on the upper andlower copper layers and performing exposing/etching on the dry films.

Insulation layers 1303 may be formed in the respective coil patterns1301 a, and a copper layer 1304 for interconnection wiring may be formedon the lower coil pattern (Operation 1322).

A temperature sensor pattern 1305 may be formed by patterning thetemperature sensor 1305 on the region of the insulation layer 1303 wherethe coil pattern 1302 is not disposed (Operation 1323).

The temperature sensor pattern 1305 and the copper layer 1304 forinterconnection wiring may be connected to each other by forming vias1306. The vias 1306 may be formed using a drill. The vias 1306 may beplated (Operation 1324).

A dry film 1307 may be applied to the copper layer 1304 after the vias1306 are formed, and exposing/etching/masking operations may then beperformed (Operation 1325).

Temperature sensor wires 1308 may be formed by removing the dry film1307 (Operation 1326). The temperature sensor wires 1308 may beelectrically connected to the vias.

Last, the temperature sensor pattern may be completely manufactured bylaminating protection films 1309 on the temperature sensor pattern 1305and the temperature sensor wire layer 1308, respectively.

FIG. 14A illustrates a method for manufacturing a temperature sensor inwhich wires and coils are formed in the same layer according to variousembodiments of the present disclosure, and FIG. 14B illustrates aflowchart of a manufacturing method according to various embodiments ofthe present disclosure.

The method for manufacturing a temperature sensor in which wires andcoils are formed in the same layer, according to the various embodimentsof the present disclosure, will be described with reference to FIGS. 14Aand 14B.

Upper and lower copper layers 1401 may be formed on the top and bottomof a prepared substrate 1400 (operation 1420; copper clad laminate(CCL)).

Dry films 1402 may be applied to the upper and lower copper layers 1401,respectively, and an exposing process may then be performed (operation1421; dry film masking).

The upper and lower copper layers 1401 may be subjected to etching afterthe exposing process, and the dry films may be removed (operation 1422).Coil patterns 1403 and a temperature sensor wire layer 1404 may beformed by this process.

The regions between the coil patterns 1403 or the regions between thecoil patterns 1403 and the temperature sensor wire layer 1404 may beinsulated, and vias 1405 may then be formed on the temperature sensorwire layer 1404. A temperature sensor pattern 1406 and the copper layer1404 for interconnection wiring may be connected to each other by thevias 1405. The vias 1405 may be formed using a drill. The vias 1405 maybe plated.

The temperature sensor pattern 1406 may be formed on the vias 1405(Operation 1424).

Last, the temperature sensor pattern may be completely manufactured bylaminating a protection film 1407 on the temperature sensor pattern 1406(operation 1425).

In a case where the temperature sensor pattern, according to the variousembodiments, is formed of a metal material, the temperature sensorpattern may be formed through dry film/exposing/etching, similar to aprinted circuit board.

Meanwhile, in a case where the temperature sensor pattern, according tothe various embodiments, is formed of a ceramic material, a sinteringprocess is required after the temperature sensor pattern is printed.However, since the sintering process is performed at a high temperature,it may be possible to apply a temperature sensor pattern that isseparately manufactured at the outside. FIG. 15 illustrates a blockdiagram of an electronic device according to the present disclosure.

Referring to FIG. 15, the electronic device 1501 includes an applicationprocessor (AP) 1510, a communication interface 1520, a subscriberidentification module (SIM) card 1524, a memory 1530, a sensor 1540, aninput device 1550, a display 1560, an interface 1570, an audio 1580, acamera 1591, a power management 1595, a battery 1596, an indicator 1597,and a motor 1598.

The AP 1510 runs an operating system or an application program tocontrol a plurality of hardware or software constituent elementsconnected to the AP 1510, and may perform processing and operation ofvarious data including multimedia data. The AP 1510 may be, for example,implemented as a system on chip (SoC). According to an embodiment of thepresent disclosure, the AP 1510 further includes a graphical processingunit (GPU). The AP 1510 further includes at least one of otherconstitute elements (e.g., the cellular interface 1521). The AP 1510loads an instruction or data, which is received from a non-volatilememory connected to each or at least one of other constituent elements,to a volatile memory and processes the loaded instruction or data. Inaddition, the AP 1510 stores in the non-volatile memory, data receivedfrom at least one of the other constituent elements or generated by atleast one of the other constituent elements.

The communication interface 1520 performs data transmission/reception incommunication between the electronic device 1501 and other electronicdevices connected through a network. According to an embodiment of thepresent disclosure, the communication interface 1520 includes cellularinterface 1521, a Wi-Fi interface 1523, a BT interface 1525, a GPSinterface 1527, an NFC interface 1528, and a radio frequency (RF)interface 1529.

The cellular interface 1521 provides voice telephony, a video telephony,a text service, an Internet service, and the like, through atelecommunication network (e.g., LTE, LTE-A, CDMA, WCDMA, UMTS, WiBro,GSM, and the like). In addition, the cellular interface 221 may, forexample, use a SIM card 1524 to perform electronic device distinctionand authorization within the telecommunication network. According to anembodiment of the present disclosure, the cellular interface 1521 mayperform at least some of functions that the AP 1510 may provide. Forexample, the cellular interface 1521 performs at least one part of amultimedia control function.

The WiFi interface 223, the BT interface 1525, the GPS interface 1527and the NFC interface 1528 each may include, for example, a processorfor processing data transmitted/received through the correspondinginterface. According to an embodiment of the present disclosure, atleast some (e.g., two or more) of the cellular interface 1521, the WiFiinterface 1523, the BT interface 1525, the GPS interface 1527 and theNFC interface 1528 are included within one IC or IC package.

The RF interface 1529 performs transmission/reception of data, forexample, transmission/reception of an RF signal. The RF interface 1529may include, for example, a transceiver, a power amplifier module (PAM),a frequency filter, a low noise amplifier (LNA), an antenna and thelike. According to an embodiment of the present disclosure, at least oneof the cellular interface 1521, the WiFi interface 1523, the BTinterface 1525, the GPS interface 1527 or the NFC interface 1528 mayperform transmission/reception of an RF signal through a separate RFinterface.

The SIM card 1524 includes a SIM, and may be inserted into a slotprovided in a specific position of the electronic device 1501. The SIMcard 1524 includes unique identification information (e.g., anintegrated circuit card ID (ICCID)) or subscriber information (e.g., aninternational mobile subscriber identity (IMSI)).

The memory 230 includes an internal memory 1532 or an external memory234. The internal memory 1532 includes, for example, at least one of avolatile memory (e.g., a dynamic random access memory (DRAM), a staticRAM (SRAM) and a synchronous DRAM (SDRAM)) or a non-volatile memory(e.g., a one-time programmable read only memory (OTPROM), a programmableROM (PROM), an erasable and programmable ROM (EPROM), an electricallyerasable and programmable ROM (EEPROM), a mask ROM, a flash ROM, a notand (NAND) flash memory, and a not or (NOR) flash memory).

According to an embodiment of the present disclosure, the internalmemory 1532 may be a solid state drive (SSD). The external memory 1534may further include a flash drive, for example, compact flash (CF),secure digital (SD), micro-SD, mini-SD, extreme digital (xD), a memorystick, and the like. The external memory 1534 may be operativelyconnected with the electronic device 1501 through various interfaces.

The sensor 1540 measures a physical quantity or detects an activationstate of the electronic device 101, and converts measured or detectedinformation into an electric signal. The sensor module 1540 includes,for example, at least one of a gesture sensor 1540A, a gyro sensor1540B, an air pressure sensor 1540C, a magnetic sensor 1540D, anacceleration sensor 1540E, a grip sensor 1540F, a proximity sensor1540G, a color sensor 1540H (e.g., a red, green, blue (RGB) sensor), abio-physical sensor 1540I, a temperature/humidity sensor 1540J, anillumination sensor 1540K, a ultraviolet (UV) sensor 1540M, and thelike. Additionally or alternatively, the sensor 1540 may also include,for example, an E-nose sensor, an electromyography (EMG) sensor, anelectroencephalogram (EEG) sensor, an electrocardiogram (ECG) sensor, aninfrared (IR) sensor, an iris sensor, a fingerprint sensor, and thelike. The sensor 1540 may further include a control circuit forcontrolling at least one or more sensors belonging therein.

The input device 1550 includes a touch panel 1552, a (digital) pensensor 1554, a key 1556, an ultrasonic input device 1558, and the like.The touch panel 1552 may, for example, detect a touch input in at leastone of a capacitive overlay scheme, a pressure sensitive scheme, aninfrared beam scheme, and an acoustic wave scheme. The touch panel 1552may also include a control circuit. In a case of the capacitive overlayscheme, physical contact or proximity detection is possible. The touchpanel 1552 may further include a tactile layer, to provide a tactileresponse to a user.

The (digital) pen sensor 1554 may be implemented in the same or similarmethod to receiving a user's touch input or by using a separate sheetfor detection. The key 1556 may include, for example, a physical button,an optical key, or a keypad. The ultrasonic input device 1558 is capableof identifying data by detecting a sound wave in the electronic device1501 through an input tool generating an ultrasonic signal, and enableswireless detection. According to an embodiment of the presentdisclosure, the electronic device 1501 may also use the communicationinterface 1520 to receive a user input from a connected external device(e.g., a computer or a server).

The display 1560 (e.g., the display 160) includes a panel 1562, ahologram device 1564, or a projector 1566. The panel 1562 may be, forexample, an LCD, an active-matrix organic LED (AMOLED), and the like.The panel 1562 may be, for example, implemented to be flexible,transparent, or wearable. The panel 1562 may be constructed as onemodule along with the touch panel 1552 as well. The hologram device 1564may use interference of light to show a three-dimensional image in theair. The projector 1566 may project light to a screen to display animage. The screen may be, for example, located inside or outside theelectronic device 1501. According to an embodiment of the presentdisclosure, the display 1560 may further include a control circuit forcontrolling the panel 1562, the hologram device 1564, or the projector1566.

The interface 1570 includes, for example, a high-definition multimediainterface (HDMI) 1572, a universal service bus (USB) 1574, an opticalinterface 1576, or a D-subminiature (D-sub) 1578. Additionally oralternatively, the interface 1570 includes, for example, a mobilehigh-definition link (MHL) interface, an SD card/multimedia card (MMC)interface or an infrared data association (IrDA) standard interface.

The audio 1580 converts a voice and an electric signal interactively.The audio 1580 may, for example, process sound information which isinputted or outputted through a speaker 1582, a receiver 1584, anearphone 1586, the microphone 1588, and the like.

The camera 1591 takes still pictures and moving pictures. According toan embodiment of the present disclosure, the camera 1591 includes one ormore image sensors (e.g., a front sensor or a rear sensor), a lens, animage signal processor (ISP), or a flash (e.g., an LED or a xenon lamp).

The power management 1595 manages electric power of the electronicdevice 1501. The power management 1595 includes, for example, a powermanagement integrated circuit (PMIC), a charger IC, a battery, a batterygauge, and the like.

The PMIC may be, for example, mounted within an integrated circuit or anSoC semiconductor. A charging scheme may be divided into a wiredcharging scheme and a wireless charging scheme. The charger IC chargesthe battery 1596, and prevents the inflow of overvoltage or overcurrentfrom an electric charger. According to an embodiment of the presentdisclosure, the charger IC includes a charger IC for at least one of thewired charging scheme or the wireless charging scheme. The wirelesscharging scheme may, for example, be a magnetic resonance scheme, amagnetic induction scheme, an electromagnetic wave scheme, and the like.A supplementary circuit for wireless charging, for example, a circuit,such as a coil loop, a resonance circuit, a rectifier, and the like, maybe added.

The battery gauge may, for example, measure a level of the battery 1596,a voltage during charging, a current or a temperature. The battery 1596generates or stores electricity, and uses the stored or generatedelectricity to supply power to the electronic device 1501. The battery1596 may include, for example, a rechargeable battery or a solarbattery.

The indicator 1597 displays a specific status of the electronic device1501 or one part (e.g., the AP 1510) thereof, for example a bootingstate, a message state, a charging state, and the like. The motor 1598may convert an electric signal into a mechanical vibration. Theelectronic device 101 may include a processing device (e.g., a GPU) formobile TV support. The processing device for mobile TV support may, forexample, process media data according to the standards of digitalmultimedia broadcasting (DMB), digital video broadcasting (DVB), a mediaflow, and the like.

Each of the above-described elements of the electronic device mayinclude one or more components, and the name of a corresponding elementmay vary according to the type of electronic device. The electronicdevice according to the present disclosure may include at least one ofthe above-described elements and may exclude some of the elements orfurther include other additional elements. Further, some of the elementsof the electronic device according to the present disclosure may becoupled to form a single entity while performing the same functions asthose of the corresponding elements before the coupling.

Although the present disclosure has been described with an exemplaryembodiment, various changes and modifications may be suggested to oneskilled in the art. It is intended that the present disclosure encompasssuch changes and modifications as fall within the scope of the appendedclaims.

What is claimed is:
 1. A portable communication device comprising: afirst printed circuit board (PCB) including charging circuitry; a secondPCB including at least one antenna and at least one temperature sensor,the at least one antenna electrically connected with the chargingcircuitry; a battery pack disposed to face at least one portion of thefirst PCB or at least one portion the second PCB; and a housing in whichthe battery pack is accommodated, the housing including an opening inwhich at least part of the at least one temperature sensor isaccommodated.
 2. The portable communication device of claim 1, whereinthe housing comprises a front cover and a rear cover coupled to thefront cover, and wherein the second PCB mounted on the rear cover. 3.The portable communication device of claim 1, wherein the at least onetemperature sensor is disposed adjacent to the at least one antenna. 4.The portable communication device of claim 1, wherein the second PCBcomprises a first flexible printed circuit board (FPCB) and a secondFPCB, and wherein the at least one antenna is mounted on the first FPCBand the at least one temperature sensor is mounted on the second FPCB.5. The portable communication device of claim 1, wherein the at leastone temperature sensor is disposed adjacent to a protection circuitmodule (PCM) of the battery pack to face the PCM of the battery pack. 6.The portable communication device of claim 1, wherein a heat shieldingmaterial are attached to at least one portion of the second PCB.
 7. Theportable communication device of claim 1, wherein a thermal spreadingsheet is attached to the at least one antenna other than the at leastone temperature sensor.
 8. The portable communication device of claim 1,wherein a thermal spreading sheet is attached to another antenna mountedon the second PCB other than the at least one temperature sensor.
 9. Theportable communication device of claim 1, wherein the at least oneantenna comprises a first conductive line and a second conductive line,the first conductive line capable of receiving or transmitting electricpower wirelessly, and the second conductive line to electrically connectthe first conductive line with the charging circuitry.
 10. A portablecommunication device comprising: a support structure; a display disposedon a first surface of the support structure; a first PCB disposed on asecond surface opposite to the first surface of the support structure; ahousing coupled to the support structure; a battery pack accommodated inthe housing; a second PCB mounted on the housing; at least one wirelesscharging coil provided on the second PCB; and at least one temperaturesensor disposed adjacent to the at least one wireless charging coil andaccommodated in a recess formed on the housing.
 11. The portablecommunication device of claim 10, wherein the second PCB includes a nearfiled communication antenna around the at least one wireless chargingcoil.
 12. The portable communication device of claim 10, wherein thesecond PCB comprises a flexible printed circuit board (FPCB).
 13. Theportable communication device of claim 10, wherein the battery pack isdisposed parallel to the first PCB without overlapping with the firstPCB, and wherein the at least one wireless charging coil is disposed tooverlap the battery pack while facing the battery pack.
 14. A portablecommunication device comprising: a first plate directed in a firstdirection, a second plate directed in a second direction opposite to thefirst direction, and a side member configured to surround at least apart of a space between the first and second plates; a first printedcircuit board (PCB) disposed between the first and second plates andincludes charging circuitry; a second PCB disposed between the first PCBand the second plate, the second PCB electrically connected with thecharging circuitry and including at least one antenna pattern; and atemperature sensor adapted to measure a temperature in relation with anoperation of the charging circuitry.
 15. The portable communicationdevice of claim 14, wherein at least part of the temperature sensor isdisposed in an interior of the second PCB.
 16. The portablecommunication device of claim 14, wherein the second PCB comprises: aflexible printed circuit board (FPCB); the at least one antenna patterncomprising a first coil-type antenna pattern and a second coil-typeantenna pattern configured to surround the first coil-type antennapattern when viewed from above the second plate; and the temperaturesensor disposed outside the second coil-type antenna pattern when viewedfrom above the second plate.
 17. The portable communication device ofclaim 14, wherein the second PCB comprises: an FPCB; the at least oneantenna pattern comprising a first coil-type antenna pattern and asecond coil-type antenna pattern configured to surround the firstcoil-type antenna pattern when viewed from above the second plate; andthe temperature sensor disposed within an area surrounded by the firstcoil-type antenna pattern when viewed from above the second plate. 18.The portable communication device of claim 14, wherein the second PCBcomprises: an FPCB; the at least one antenna pattern comprising a firstcoil-type antenna pattern and a second coil-type antenna patternconfigured to surround the first coil-type antenna pattern when viewedfrom above the second plate; and the temperature sensor disposed to atleast partially overlap the first coil-type antenna pattern when viewedfrom above the second plate.
 19. The portable communication device ofclaim 14, wherein the second PCB comprises: an FPCB; the at least oneantenna pattern comprising at least one coil-type antenna pattern; andthe temperature sensor disposed outside the at least one antenna patternwhen viewed from above the second plate.
 20. The portable communicationdevice of claim 14, further comprising a thermal spreading sheetdisposed between the first and second PCBs, wherein the temperaturesensor is disposed to make contact with, or adjacent to, a part of thethermal spreading sheet, and wherein the thermal spreading sheet isdisposed to at least partially contact the second PCB.